this is information on a product in full production. november 2014 docid027082 rev 1 1/8 STPS20H100C-Y automotive power schottky rectifier datasheet ? production data features ? negligible switching losses ? high junction temperature capability ? good trade off between leakage current and forward voltage drop ? low leakage current ? avalanche rated ? aec-q101 qualified. ? ppap c apable description dual center tap schottky rectifier designed for high frequency miniature switched mode power supplies such as adaptators and on board dc/dc converters for automotive applications. . $ $ . ' e 3 $ . $ $ table 1. device summary symbol value i f(av) 2 x 10 a v rrm 100 v t j(max) 175 c v f (typ) 0.59 v www.st.com
characteristics STPS20H100C-Y 2/8 docid027082 rev 1 1 characteristics when the diodes 1 and 2 are used simultaneously: tj(diode 1) = p(diode1) x r th(j-c) (per diode) + p(diode 2) x r th(c) table 2. absolute ratings (limiting values per diode at 25 c, unless otherwise specified) symbol parameter value unit v rrm repetitive peak reverse voltage 100 v i f(rms) forward rms current 30 a i f(av) average forward current, = 0.5, t c = 160 c per diode 10 a per device 20 i fsm surge non repetitive forward current t p = 10 ms sinusoidal 250 a i rsm non repetitive peak reverse current t p = 100 s square 3 a p arm (1) repetitive peak avalanche power t p = 10 s, t j = 125 c 780 w t stg storage temperature range -65 to +175 c t j operating junction temperature (2) -40 to +175 c 1. for pulse time duration deratings, please refer to figure 3 . more details regarding the avalanche energy measurements and diode validation in the avalanche are provided in the stmicroelectronics application notes an1768, ?admissible avalanche power of schottky diodes? and an2025, ?converter improvement using schottky rectifier avalanche specification?. 2. condition to avoid thermal runaway for a diode on its own heatsink dptot dtj < 1 rth(j-a) table 3. thermal parameters symbol parameter value unit r th(j-c) junction to case per diode 1.6 c/w per device 0.9 r th(c) coupling 0.15 table 4. static electrical characteristics (per diode) symbol parameter test conditions min. typ max. unit i r (1) reverse leakage current t j = 25 c v r = v rrm --4.5a t j = 125 c - 2 6 ma v f (2) forward voltage drop t j = 25 c i f = 10 a - - 0.77 v t j = 125 c - 0.59 0.64 t j = 25 c i f = 20 a - - 0.88 t j = 125 c - 0.67 0.73 1. pulse test: t p = 5 ms, < 2% 2. pulse test: t p = 380 s, < 2%
docid027082 rev 1 3/8 STPS20H100C-Y characteristics 8 to evaluate the conduction losses use the following equation: p = 0.55 x i f(av) + 0.009 x i f 2 (rms) figure 1. average forward power dissipation versus average forward current (per diode) figure 2. average forward current versus ambient temperature ( = 0.5, per diode) p (w) f(av) 024681012 0 2 4 6 8 t =tp/t tp i (a) f(av) = 0.05 = 0.1 = 0.2 = 0.5 = 1 7 d p e ? & 5 w k m d 5 w k m f , ) $ 9 $ 7 / w s 7 w s figure 3. normalized avalanche power derating versus pulse duration figure 4. relative variation of thermal impedance junction to case versus pulse duration (per diode) w 3 ? v 3 $ 5 0 w 3 3 $ 5 0 ? v z/r th(j-c) th(j-c) 1e-3 1e-2 1e-1 1e+0 0.0 0.2 0.4 0.6 0.8 1.0 t =tp/t tp t (s) p = 0.5 = 0.2 = 0.1 single pulse figure 5. reverse leakage current versus reverse voltage applied (typical values, per diode) figure 6. junction capacitance vs. reverse voltage applied (typical values, per diode) i (a) r 0 102030405060708090100 1e-2 1e-1 1e+0 1e+1 1e+2 1e+3 1e+4 v (v) r t =125c j t =150c j t =100c j t =25c j 1 2 5 10 20 50 100 100 200 500 1000 c(pf) v (v) r f=1mhz v =30mv t =25c osc rms j
characteristics STPS20H100C-Y 4/8 docid027082 rev 1 figure 7. forward voltage drop vs. forward current (typical values, per diode) figure 8. thermal resistance junction to ambient versus copper surface under tab i (a) fm 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0.1 1.0 10.0 100.0 v (v) fm t =125c (typical values) j t =25c j t =125c j t =150c (typical values) j 5 ? & : w k m d 6 & x f p e h s r [ \ s u l q w h g f l u f x l w e r d u g ) 5 f r s s h u w k l f n q h v v ? p
docid027082 rev 1 5/8 STPS20H100C-Y package information 8 2 package information ? epoxy meets ul94, v0 ? lead-free package ? cooling method: by conduction (c) in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 9. d 2 pak dimension definitions * / / / % % (
) o d w ] r q h q r o h v v w k d q p p $ & ' 5 $ 0 9 & $
package information STPS20H100C-Y 6/8 docid027082 rev 1 figure 10. footprint (dimensions in mm) table 5. d 2 pak dimension values ref. dimensions millimeters inches min. typ. max. min. typ. max. a 4.40 4.60 0.173 0.181 a1 2.49 2.69 0.098 0.106 a2 0.03 0.23 0.001 0.009 b 0.70 0.93 0.027 0.037 b2 1.14 1.70 0.045 0.067 c 0.45 0.60 0.017 0.024 c2 1.23 1.36 0.048 0.054 d 8.95 9.35 0.352 0.368 e 10.00 10.40 0.393 0.409 g 4.88 5.28 0.192 0.208 l 15.00 15.85 0.590 0.624 l2 1.27 1.40 0.050 0.055 l3 1.30 1.75 0.051 0.069 m 2.29 2.79 0.090 0.110 r 0.40 typ. 0.016 typ. v2 0 8 0 8
docid027082 rev 1 7/8 STPS20H100C-Y ordering information 8 3 ordering information 4 revision history table 6. ordering information order code marking package weight base qty delivery mode stps20h100cgy-tr stps20h100cgy d2pak 1.48 g 1000 tape and reel table 7. revision history date revision changes 19-nov-2014 1 first issue
STPS20H100C-Y 8/8 docid027082 rev 1 important notice ? please read carefully stmicroelectronics nv and its subsidiaries (?st?) reserve the right to make changes, corrections, enhancements, modifications, and improvements to st products and/or to this document at any time without notice. purchasers should obtain the latest relevant in formation on st products before placing orders. st products are sold pursuant to st?s terms and conditions of sale in place at the time of o rder acknowledgement. purchasers are solely responsible for the choice, selection, and use of st products and st assumes no liability for application assistance or the design of purchasers? products. no license, express or implied, to any intellectual property right is granted by st herein. resale of st products with provisions different from the information set forth herein shall void any warranty granted by st for such product. st and the st logo are trademarks of st. all other product or service names are the property of their respective owners. information in this document supersedes and replaces information previously supplied in any prior versions of this document. ? 2014 stmicroelectronics ? all rights reserved
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